Designed to use small-volume thick-film resistor types, Danyu Technology wholesale|manufactured, providing one-stop solutions for thick-film resistor series.
Thick film resistors are produced by applying a
resistive film or paste, a mixture of glass and conductive materials, to a
substrate. Thick film technology allows high resistance values to be printed on
a cylindrical or flat substrate either covered entirely or in various patterns.
They also can be printed in a serpentine design to eliminate inductance, which
is preferred in applications with steady frequencies. Once applied, the
resistance is adjusted using a laser or abrasive trimmer.
Thick film technology is generally used to produce
electronic devices such as resistance cards, surface mount devices, hybrid integrated circuits,sensors and other high-power devices.
The RHP series delivers 600W continuous power when
properly mounted to a liquid-cooled heat sink (based on 75°C mounting plate
temperature).
· Non-inductive
· Resistance values range from 1-100M
· Trimming used is Abrasive or Laser
· High power
· High voltage resistance, can withstand 12KV voltage
· Terminal installed the M4 screw torque: 2 Nm
· Inductance < 80nH
· Insulation resistance 500V, 104M
· Max operating voltage range is 50 to 200V
· Tolerance is ±1 to ±5%
· Voltage Power Supply Control Equipment
· Motor Controlling
· Robot System
· Shift Drive, Frequency Converter
· Frequency Converter
The thick film resistor can be constructed by
applying the silk-screening conductive paste on top of an insulating substrate.
This conductive paste can be fired to make a permanent connection. The paste is
applied to a ceramic substrate made from aluminum oxide powder, mixed with
glass frit and a small amount of an organic binder to hold the powder together
during firing.
Compared with the Thick Film Ceramic Board, the thick film resistors
are not expensive, especially in large quantities and are available in small sized
which is significant in integrated & hybrid circuits as these resistors can
be printed onto the substrate to eliminate board loading as well as soldering
steps.
Power Derating Curve
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